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Heat Air Preheating Platform 600W Ptc Heating Core Temperature Control Mobile Phone Motherboard Repair Layering Glue Rem

A partire da 76,99 $
89,99 $ Sconto del - 14%
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Heat Air Preheating Platform 600W Ptc Heating Core Temperature Control Mobile Phone Motherboard Repair Layering Glue Rem

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Specifications Product Name HEAT AIR Desoldering StationOutput Power 600WDimensions 178mm x 101m…

Prezzo
76,99$ 89,99 $

Heat Air Preheating Platform 600W Ptc Heating Core Temperature Control Mobile Phone Motherboard Repair Layering Glue Rem

Specifications Product Name HEAT AIR Desoldering StationOutput Power 600WDimensions 178mm x 101mm x 45mmTemperature Settings 260℃Time Settings Adjustable from 10 seconds to 990 secondsDisplay 2 5 inch HD screenHeating Platform PTC heating technologyMaterial High quality heat conduction componentsFeatures 1 Rapid Heating Technology Equipped with a powerful 600W PTC heating core the platform heats up quickly within 60 seconds and ensures seamless layering tasks within 180 seconds 2 Intelligent Temperature and Time Control Real time temperature monitoring with a stepless dial for accurate adjustments and three memory slots for commonly used settings ensures precise operation 3 Enhanced Protection System The intelligent high temperature protection system prevents damage to the motherboard during use offering safe and efficient performance 4 Modular Design with Upgrade Capability Built with modular components this platform can be expanded to meet evolving repair needs providing flexibility in usage 5 Clear Operational Feedback The 2 5 inch screen displays a countdown timer temperature readings and operational status with visual and audible alerts for completion ensuring user confidence during repair Package Included Set A 1 x HEAT AIR Host1 x Common Module1 x Power Cord1 x Packing BoxSet B 1 x HEAT AIR Host1 x X 16PM Series Module1 x Power Cord1 x Packing Box